Building in LPC2000 (LPC2134/01)

Development Platforms
3

Yeah I think I have it working. See GitHub - maxgerhardt/T-962-improvements: Improvements made to the cheap T-962 reflow oven utilizing the _existing_ controller HW

Basically all done per docs and some scripting. Compilation works

RAM:   [==        ]  23.1% (used 3788 bytes from 16384 bytes)
Flash: [=====     ]  52.7% (used 69096 bytes from 131072 bytes)
Building .pio\build\lpc2134_01\firmware.bin
====================== [SUCCESS] Took 3.28 seconds ======================

And uploading works with precompiled lpc21isp programs for, provided for Window and Linux. So a PlatformIO “Upload” will trigger the exact same thing as a make flash in the original repo you linked.

Uploading .pio\build\lpc2134_01\firmware.bin
Use manually specified: COM1
Firmware path: .pio\build\lpc2134_01\firmware.hex
lpc21isp_win.exe .pio\build\lpc2134_01\firmware.hex COM1 57600 11059
lpc21isp version 1.97
File .pio\build\lpc2134_01\firmware.hex:
        loaded...
Start Address = 0x000000C4
...

I don’t have that microcontroller or soldering iron to test, so that’s up to you.

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